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Embedded - CPLDs (Complex Programmable Logic Devices)

Embedded - CPLDs (Complex Programmable Logic Devices)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - CPLDs (Complex Programmable Logic Devices)
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Package / Case
EPM7128BTC144-10N Altera (Intel® Programmable Solutions Group) IC CPLD 128MC 10NS 144TQFP MAX® 7000B 0°C ~ 70°C (TA) Tray Surface Mount - - - - 144-LQFP
LC4128V-5T100C Lattice Semiconductor IC CPLD 128MC 5NS 100TQFP ispMACH® 4000V 0°C ~ 90°C (TJ) Tray Surface Mount - - - - 100-LQFP
EPM7128STC100-10 Altera (Intel® Programmable Solutions Group) IC CPLD 128MC 10NS 100TQFP MAX® 7000S 0°C ~ 70°C (TA) Tray Surface Mount - - - - 100-TQFP
M4A3-192/96-7FAI Lattice Semiconductor IC CPLD 192MC 7.5NS 144FBGA ispMACH® 4A -40°C ~ 85°C (TA) Tray Surface Mount - - - - 144-BGA
ISPLSI 5256VE-125LB272 Lattice Semiconductor IC CPLD 256MC 7.5NS 272BGA ispLSI® 5000VE 0°C ~ 70°C (TA) Tray Surface Mount - - - - 272-BBGA
M4A3-32/32-12JI Lattice Semiconductor IC CPLD 32MC 12NS 44PLCC ispMACH® 4A -40°C ~ 85°C (TA) Tray Surface Mount - - - - 44-LCC (J-Lead)
ISPLSI 2064VE-200LB100 Lattice Semiconductor IC CPLD 64MC 4.5NS 100CABGA ispLSI® 2000VE 0°C ~ 70°C (TA) Tray Surface Mount - - - - 100-LFBGA
ISPLSI 5384VE-125LF256 Lattice Semiconductor IC CPLD 384MC 7.5NS 256FBGA ispLSI® 5000VE 0°C ~ 70°C (TA) Tray Surface Mount - - - - 256-BGA
EPM3032ATC44-10 Altera (Intel® Programmable Solutions Group) IC CPLD 32MC 10NS 44TQFP MAX® 3000A 0°C ~ 70°C (TA) Tray Surface Mount - - - - 44-TQFP
ISPLSI 2128A-80LT176I Lattice Semiconductor IC CPLD 128MC 15NS 176TQFP ispLSI® 2000A -40°C ~ 85°C (TA) Tray Surface Mount - - - - 176-LQFP

About Embedded - CPLDs (Complex Programmable Logic Devices)


CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.