Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LC4512C-75T176C | Lattice Semiconductor | IC CPLD 512MC 7.5NS 176TQFP | ispMACH® 4000C | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| XCR3256XL-10TQG144C | Xilinx | IC CPLD 256MC 9NS 144TQFP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| ATF1504ASV-15AC100 | Micrel / Microchip Technology | IC CPLD 64MC 15NS 100TQFP | ATF15xx | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| M5-320/160-12YI | Lattice Semiconductor | IC CPLD 320MC 12NS 208QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| ATF1504ASVL-20AC100 | Micrel / Microchip Technology | IC CPLD 64MC 20NS 100TQFP | ATF15xx | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| XCR3512XL-10FG324C | Xilinx | IC CPLD 512MC 9NS 324BGA | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 324-BBGA | |
| ATF1504ASVL-20AU44 | Micrel / Microchip Technology | IC CPLD 64MC 20NS 44TQFP | ATF15xx | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| EPM7064AETC44-4 | Intel® FPGAs | IC CPLD 64MC 4.5NS 44TQFP | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| ISPLSI 1016E-80LJ | Lattice Semiconductor | IC CPLD 64MC 15NS 44PLCC | ispLSI® 1000E | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| GAL20RA10B-10LP | Lattice Semiconductor | IC CPLD 10MC 10NS 24DIP | GAL®20RA10 | 0°C ~ 75°C (TA) | Tube | Through Hole | - | - | - | - | 24-DIP (0.300", 7.62mm) |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.