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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ATF2500C-20JC | Micrel / Microchip Technology | IC CPLD 24MC 20NS 44PLCC | ATF2500C(L) | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| M4A5-96/48-12VI | Lattice Semiconductor | IC CPLD 96MC 12NS 100TQFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| CY37064VP100-100AXI | Cypress Semiconductor | IC CPLD 64MC 12NS 100LQFP | Ultra37000™ | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| LC4256C-5T176C | Lattice Semiconductor | IC CPLD 256MC 5NS 176TQFP | ispMACH® 4000C | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| LC4384V-35FTN256C | Lattice Semiconductor | IC CPLD 384MC 3.5NS 256FTBGA | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| LC4256C-75FT256AC | Lattice Semiconductor | IC CPLD 256MC 7.5NS 256FTBG | ispMACH® 4000C | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| XC9572XL-5CS48C | Xilinx | IC CPLD 72MC 5NS 48CSBGA | XC9500XL | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 48-FBGA, CSPBGA | |
| M5-256/68-12VC/1 | Lattice Semiconductor | IC CPLD 256MC 12NS 100TQFP | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| CY37128VP100-83AXI | Cypress Semiconductor | IC CPLD 128MC 15NS 100LQFP | Ultra37000™ | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| LC4256B-75FTN256BI | Lattice Semiconductor | IC CPLD 256MC 7.5NS 256FTBGA | ispMACH® 4000B | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.