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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EPM7064STC44-10 | Altera (Intel® Programmable Solutions Group) | IC CPLD 64MC 10NS 44TQFP | MAX® 7000S | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| 5M240ZM100I5N | Altera (Intel® Programmable Solutions Group) | IC CPLD 192MC 7.5NS 100MBGA | MAX® V | -40°C ~ 100°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-TFBGA | |
| GAL20RA10B-20LJI | Lattice Semiconductor | IC CPLD 10MC 20NS 28PLCC | GAL®20RA10 | -40°C ~ 85°C (TA) | Tube | Surface Mount | - | - | - | - | 28-LCC (J-Lead) | |
| GAL16V8D-25LPNI | Lattice Semiconductor | IC CPLD 8MC 25NS 20DIP | GAL®16V8 | -40°C ~ 85°C (TA) | Bulk | Through Hole | - | - | - | - | 20-DIP (0.300", 7.62mm) | |
| XCR3032XL-10VQG44C | Xilinx | IC CPLD 32MC 9.1NS 44VQFP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| M5-128/68-7YI/1 | Lattice Semiconductor | IC CPLD 128MC 7.5NS 100QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-BQFP | |
| LC4512B-75FTN256I | Lattice Semiconductor | IC CPLD 512MC 7.5NS 256FTBGA | ispMACH® 4000B | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| XC95108-10PC84C | Xilinx | IC CPLD 108MC 10NS 84PLCC | XC9500 | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 84-LCC (J-Lead) | |
| M4A3-384/160-10YC | Lattice Semiconductor | IC CPLD 384MC 10NS 208QFP | ispMACH® 4A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| GAL22V10D-15LPNI | Lattice Semiconductor | IC CPLD 10MC 15NS 24DIP | GAL®22V10 | -40°C ~ 85°C (TA) | Tube | Through Hole | - | - | - | - | 24-DIP (0.300", 7.62mm) |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.