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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EPM9560RC208-15 | Altera (Intel® Programmable Solutions Group) | IC CPLD 560MC 15NS 208RQFP | MAX® 9000 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP Exposed Pad | |
| ISPLSI 2128VE-180LQ160 | Lattice Semiconductor | IC CPLD 128MC 5NS 160QFP | ispLSI® 2000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| XCR3256XL-12FTG256I | Xilinx | IC CPLD 256MC 10.8NS 256BGA | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| XA2C64A-7VQG100I | Xilinx | IC CPLD 64MC 6.7NS 100VQFP | CoolRunner II | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| XCR3384XL-10PQ208I | Xilinx | IC CPLD 384MC 9NS 208QFP | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| LC4384B-35FTN256C | Lattice Semiconductor | IC CPLD 384MC 3.5NS 256FTBGA | ispMACH® 4000B | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| LC4064B-25TN100C | Lattice Semiconductor | IC CPLD 64MC 2.5NS 100TQFP | ispMACH® 4000B | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| LC4128ZC-42T100C | Lattice Semiconductor | IC CPLD 128MC 4.2NS 100TQFP | ispMACH® 4000Z | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| LC4128V-75T100C | Lattice Semiconductor | IC CPLD 128MC 7.5NS 100TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| LC4064C-5T48C | Lattice Semiconductor | IC CPLD 64MC 5NS 48TQFP | ispMACH® 4000C | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.