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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CY37064P44-125JXC | Cypress Semiconductor | IC CPLD 64MC 10NS 44PLCC | Ultra37000™ | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| ISPLSI 2096A-100LTN128 | Lattice Semiconductor | IC CPLD 96MC 10NS 128TQFP | ispLSI® 2000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 128-LQFP | |
| M5-256/120-15YC/1 | Lattice Semiconductor | IC CPLD 256MC 15NS 160QFP | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| M5LV-128/120-10YI | Lattice Semiconductor | IC CPLD 128MC 10NS 160QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| ISPLSI 1016-60LT44I | Lattice Semiconductor | IC CPLD 64MC 20NS 44TQFP | ispLSI® 1000 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| LC4064V-10TN48I | Lattice Semiconductor | IC CPLD 64MC 10NS 48TQFP | ispMACH® 4000V | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| ISPLSI 5512VA-70LQ208 | Lattice Semiconductor | IC CPLD 512MC 15NS 208QFP | ispLSI® 5000VA | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| ATF2500C-15JI | Micrel / Microchip Technology | IC CPLD 24MC 15NS 44PLCC | ATF2500C(L) | -40°C ~ 85°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| EPM7064AETC100-7 | Intel® FPGAs | IC CPLD 64MC 7.5NS 100TQFP | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| EPM2210F256C4N | Intel® FPGAs | IC CPLD 1700MC 7NS 256FBGA | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-BGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.