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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GAL22V10D-20LPI | Lattice Semiconductor | IC CPLD 10MC 20NS 24DIP | GAL®22V10 | -40°C ~ 85°C (TA) | Bulk | Through Hole | - | - | - | - | 24-DIP (0.300", 7.62mm) | |
| CY37032VP44-100AC | Cypress Semiconductor | IC CPLD 32MC 12NS 44LQFP | Ultra37000™ | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-LQFP | |
| LC5768MV-5FN256C | Lattice Semiconductor | IC CPLD 768MC 5NS 256FBGA | ispXPLD® 5000MV | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| M5LV-512/160-12YI | Lattice Semiconductor | IC CPLD 512MC 12NS 208QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| LC51024MV-75F672I | Lattice Semiconductor | IC CPLD 1024MC 7.5NS 672FBGA | ispXPLD® 5000MV | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 672-BBGA | |
| EPM7064AETC44-4N | Intel® FPGAs | IC CPLD 64MC 4.5NS 44TQFP | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| XA2C128-7VQG100I | Xilinx | IC CPLD 128MC 7NS 100VQFP | CoolRunner II | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| ISPLSI 1048E-50LTN | Lattice Semiconductor | IC CPLD 192MC 20NS 128TQFP | ispLSI® 1000E | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 128-LQFP | |
| LC4128V-5TN128C | Lattice Semiconductor | IC CPLD 128MC 5NS 128TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 128-LQFP | |
| CY37128VP160-83AXCT | Cypress Semiconductor | IC CPLD 128MC 15NS 160LQFP | Ultra37000™ | 0°C ~ 70°C (TA) | Tape & Reel (TR) | Surface Mount | - | - | - | - | 160-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.