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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC95216-10PQG160C | Xilinx | IC CPLD 216MC 10NS 160QFP | XC9500 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| LC4128ZE-7TCN100C | Lattice Semiconductor | IC CPLD 128MC 7.5NS 100TQFP | ispMACH® 4000ZE | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| 5M160ZE64I5N | Altera (Intel® Programmable Solutions Group) | IC CPLD 128MC 7.5NS 64EQFP | MAX® V | -40°C ~ 100°C (TJ) | Tray | Surface Mount | - | - | - | - | 64-TQFP Exposed Pad | |
| EPM3256ATC144-7N | Altera (Intel® Programmable Solutions Group) | IC CPLD 256MC 7.5NS 144TQFP | MAX® 3000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| ISPLSI 2064VE-135LT44 | Lattice Semiconductor | IC CPLD 64MC 7.5NS 44TQFP | ispLSI® 2000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| XCR3256XL-7TQG144C | Xilinx | IC CPLD 256MC 7NS 144TQFP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| EPM7032AELC44-4 | Intel® FPGAs | IC CPLD 32MC 4.5NS 44PLCC | MAX® 7000A | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| LC4128B-5TN100I | Lattice Semiconductor | IC CPLD 128MC 5NS 100TQFP | ispMACH® 4000B | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| EPM570T100C4 | Intel® FPGAs | IC CPLD 440MC 5.4NS 100TQFP | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| LC4064C-75TN100C | Lattice Semiconductor | IC CPLD 64MC 7.5NS 100TQFP | ispMACH® 4000C | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.