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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ISPLSI 1032-90LT | Lattice Semiconductor | IC CPLD 128MC 12NS 100TQFP | ispLSI® 1000 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| EPM1270GT144C4 | Intel® FPGAs | IC CPLD 980MC 6.2NS 144TQFP | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| XC2C512-10PQ208I | Xilinx | IC CPLD 512MC 9.2NS 208QFP | CoolRunner II | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| 5M240ZM100C4N | Intel® FPGAs | IC CPLD 192MC 7.5NS 100MBGA | MAX® V | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-TFBGA | |
| EPM7160SLC84-10 | Altera (Intel® Programmable Solutions Group) | IC CPLD 160MC 10NS 84PLCC | MAX® 7000S | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 84-LCC (J-Lead) | |
| CY37032P44-125AXC | Cypress Semiconductor | IC CPLD 32MC 10NS 44LQFP | Ultra37000™ | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-LQFP | |
| LA4128V-75TN100E | Lattice Semiconductor | IC CPLD 128MC 7.5NS 100TQFP | LA-ispMACH | -40°C ~ 125°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| GAL22V10D-4LJ | Lattice Semiconductor | IC CPLD 10MC 4NS28PLCC | GAL®22V10 | 0°C ~ 75°C (TA) | Tube | Surface Mount | - | - | - | - | 28-LCC (J-Lead) | |
| EPM7064BFC100-3 | Altera (Intel® Programmable Solutions Group) | IC CPLD 64MC 3.5NS 100FBGA | MAX® 7000B | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LBGA | |
| M4A3-32/32-5JNC | Lattice Semiconductor | IC CPLD 32MC 5NS 44PLCC | ispMACH® 4A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-LCC (J-Lead) |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.