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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GAL16V8D-15LPI | Lattice Semiconductor | IC CPLD 8MC 15NS 20DIP | GAL®16V8 | -40°C ~ 85°C (TA) | Bulk | Through Hole | - | - | - | - | 20-DIP (0.300", 7.62mm) | |
| EPM3064ATC100-4N | Altera (Intel® Programmable Solutions Group) | IC CPLD 64MC 4.5NS 100TQFP | MAX® 3000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| EPM1270F256C5 | Intel® FPGAs | IC CPLD 980MC 6.2NS 256FBGA | MAX® II | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| XC2C64A-7VQ44C | Xilinx | IC CPLD 64MC 6.7NS 44VQFP | CoolRunner II | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| ISPLSI 5128VE-180LT128 | Lattice Semiconductor | IC CPLD 128MC 5NS 128TQFP | ispLSI® 5000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 128-LQFP | |
| ISPGAL22V10AV-75LJI | Lattice Semiconductor | IC CPLD 10MC 7.5NS 28PLCC | ispGAL™22V10 | -40°C ~ 85°C (TA) | Tube | Surface Mount | - | - | - | - | 28-LCC (J-Lead) | |
| EPM7032TC44-12 | Altera (Intel® Programmable Solutions Group) | IC CPLD 32MC 12NS 44TQFP | MAX® 7000 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| 5M80ZM64C4N | Intel® FPGAs | IC CPLD 64MC 7.5NS 64MBGA | MAX® V | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 64-TFBGA | |
| M4A3-256/128-10FANI | Lattice Semiconductor | IC CPLD 256MC 10NS 256FBGA | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| LC5768MV-75F484C | Lattice Semiconductor | IC CPLD 768MC 7.5NS 484FBGA | ispXPLD® 5000MV | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 484-BBGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.