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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LC5768VG-75F256I | Lattice Semiconductor | IC CPLD 768MC 7.5NS 256FBGA | ispMACH™ 5000VG | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| CY37256VP160-66AXC | Cypress Semiconductor | IC CPLD 256MC 20NS 160LQFP | Ultra37000™ | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-LQFP | |
| ISPLSI 1024-60LJ | Lattice Semiconductor | IC CPLD 64MC 20NS 68PLCC | ispLSI® 1000 | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 68-LCC (J-Lead) | |
| ISPLSI 2032A-80LJN44 | Lattice Semiconductor | IC CPLD 32MC 15NS 44PLCC | ispLSI® 2000A | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| GAL20V8B-10LP | Lattice Semiconductor | IC CPLD 8MC 10NS 24DIP | GAL®20V8 | 0°C ~ 75°C (TA) | Tube | Through Hole | - | - | - | - | 24-DIP (0.300", 7.62mm) | |
| ISPLSI 5256VE-125LF256I | Lattice Semiconductor | IC CPLD 256MC 7.5NS 256FBGA | ispLSI® 5000VE | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| LC4064B-75T48I | Lattice Semiconductor | IC CPLD 64MC 7.5NS 48TQFP | ispMACH® 4000B | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| XC95108-15PCG84C | Xilinx | IC CPLD 108MC 15NS 84PLCC | XC9500 | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 84-LCC (J-Lead) | |
| M5-192/120-12YI/1 | Lattice Semiconductor | IC CPLD 192MC 12NS 160QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| EPM7064LC68-12MM | Altera (Intel® Programmable Solutions Group) | IC CPLD 64MC 12NS 68PLCC | MAX® 7000 | 0°C ~ 70°C (TA) | Tray | - | - | - | - | - | - |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.