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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC95144-10PQ100C | Xilinx | IC CPLD 144MC 10NS 100QFP | XC9500 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-BQFP | |
| M4A5-192/96-12VNI | Lattice Semiconductor | IC CPLD 192MC 12NS 144TQFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| LC4256V-10TN176I | Lattice Semiconductor | IC CPLD 256MC 10NS 176TQFP | ispMACH® 4000V | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| ISPLSI 1016-90LT44 | Lattice Semiconductor | IC CPLD 64MC 12NS 44TQFP | ispLSI® 1000 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| XC95288XL-7PQ208I | Xilinx | IC CPLD 288MC 7.5NS 208QFP | XC9500XL | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| 5M2210ZF324C4N | Intel® FPGAs | IC CPLD 1700MC 7NS 324FBGA | MAX® V | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 324-LBGA | |
| EPM7160STC100-7 | Altera (Intel® Programmable Solutions Group) | IC CPLD 160MC 7.5NS 100TQFP | MAX® 7000S | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| EPM7064SLI44-7N | Altera (Intel® Programmable Solutions Group) | IC CPLD 64MC 7.5NS 44PLCC | MAX® 7000S | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| XCR3128XL-10CSG144C | Xilinx | IC CPLD 128MC 9.1NS 144BGA | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 144-TFBGA, CSPBGA | |
| LC5512MV-75FN484C | Lattice Semiconductor | IC CPLD 512MC 7.5NS 484FBGA | ispXPLD® 5000MV | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 484-BBGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.