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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EPM7096LC68-10 | Altera (Intel® Programmable Solutions Group) | IC CPLD 96MC 10NS 68PLCC | MAX® 7000 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 68-LCC (J-Lead) | |
| LC4512V-5TN176I | Lattice Semiconductor | IC CPLD 512MC 5NS 176TQFP | ispMACH® 4000V | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 176-LQFP | |
| ISPLSI 5384VE-165LF256 | Lattice Semiconductor | IC CPLD 384MC 6NS 256FBGA | ispLSI® 5000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| XCR3032XL-7VQG44C | Xilinx | IC CPLD 32MC 7NS 44VQFP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| CY37128P160-167AXC | Cypress Semiconductor | IC CPLD 128MC 6.5NS 160LQFP | Ultra37000™ | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-LQFP | |
| CY37192P160-125AC | Cypress Semiconductor | IC CPLD 192MC 10NS 160LQFP | Ultra37000™ | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-LQFP | |
| ISPLSI 5128VE-100LT128I | Lattice Semiconductor | IC CPLD 128MC 10NS 128TQFP | ispLSI® 5000VE | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 128-LQFP | |
| EPM7064AETC100-10 | Intel® FPGAs | IC CPLD 64MC 10NS 100TQFP | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| EPM7256AETI100-7 | Intel® FPGAs | IC CPLD 256MC 7.5NS 100TQFP | MAX® 7000A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| XC95288XL-10BG256I | Xilinx | IC CPLD 288MC 10NS 256BGA | XC9500XL | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BBGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.