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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CY37256VP256-66BBI | Cypress Semiconductor | IC CPLD 256MC 20NS 256LFBGA | Ultra37000™ | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| LC4128ZE-5TN100C | Lattice Semiconductor | IC CPLD 128MC 5.8NS 100TQFP | ispMACH® 4000ZE | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| EPM7032SQC44-5 | Altera (Intel® Programmable Solutions Group) | IC CPLD 32MC 5NS 44PLCC | MAX® 7000S | -40°C ~ 85°C (TA) | Tray | - | - | - | - | - | - | |
| LC4064ZC-75TN48C | Lattice Semiconductor | IC CPLD 64MC 7.5NS 48TQFP | ispMACH® 4000Z | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| M4A5-64/32-10VNI | Lattice Semiconductor | IC CPLD 64MC 10NS 44TQFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| GAL22V10D-25QJN | Lattice Semiconductor | IC CPLD 10MC 25NS 28PLCC | GAL®22V10 | 0°C ~ 75°C (TA) | Tray | Surface Mount | - | - | - | - | 28-LCC (J-Lead) | |
| ATF1502ASL-25JI44 | Micrel / Microchip Technology | IC CPLD 32MC 25NS 44PLCC | ATF15xx | -40°C ~ 85°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| ATF1500ABV-12JC | Micrel / Microchip Technology | IC CPLD 32MC 12NS 44PLCC | ATF15xx | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| GAL22V10D-25LJN | Lattice Semiconductor | IC CPLD 10MC 25NS 28PLCC | GAL®22V10 | 0°C ~ 75°C (TA) | Tube | Surface Mount | - | - | - | - | 28-LCC (J-Lead) | |
| ISPLSI 2064VE-100LTN100 | Lattice Semiconductor | IC CPLD 64MC 10NS 100TQFP | ispLSI® 2000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.