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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M4A3-64/32-7JNI | Lattice Semiconductor | IC CPLD 64MC 7.5NS 44PLCC | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| XC95108-20TQG100C | Xilinx | IC CPLD 108MC 20NS 100TQFP | XC9500 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| ISPLSI 5256VE-125LF256 | Lattice Semiconductor | IC CPLD 256MC 7.5NS 256FBGA | ispLSI® 5000VE | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| EPM7128AELC84-10N | Altera (Intel® Programmable Solutions Group) | IC CPLD 128MC 10NS 84PLCC | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 84-LCC (J-Lead) | |
| EPM7128AETC144-10 | Intel® FPGAs | IC CPLD 128MC 10NS 144TQFP | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 144-LQFP | |
| M5LV-384/160-7YI | Lattice Semiconductor | IC CPLD 384MC 7.5NS 208QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 208-BFQFP | |
| M4A3-32/32-10JNC | Lattice Semiconductor | IC CPLD 32MC 10NS 44PLCC | ispMACH® 4A | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-LCC (J-Lead) | |
| EPM7256AEFC256-7 | Intel® FPGAs | IC CPLD 256MC 7.5NS 256FBGA | MAX® 7000A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| 5M80ZE64C5N | Altera (Intel® Programmable Solutions Group) | IC CPLD 64MC 7.5NS 64EQFP | MAX® V | 0°C ~ 85°C (TJ) | Tray | Surface Mount | - | - | - | - | 64-TQFP Exposed Pad | |
| LC4512B-35FTN256C | Lattice Semiconductor | IC CPLD 512MC 3.5NS 256FTBGA | ispMACH® 4000B | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.