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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GAL26V12C-7LJ | Lattice Semiconductor | IC CPLD 12MC 7.5NS 28PLCC | GAL®26V12 | 0°C ~ 75°C (TA) | Tube | Surface Mount | - | - | - | - | 28-LCC (J-Lead) | |
| LC4032B-25T48C | Lattice Semiconductor | IC CPLD 32MC 2.5NS 48TQFP | ispMACH® 4000B | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| LC4128ZC-42TN100C | Lattice Semiconductor | IC CPLD 128MC 4.2NS 100TQFP | ispMACH® 4000Z | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| M4A5-64/32-12VI | Lattice Semiconductor | IC CPLD 64MC 12NS 44TQFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 44-TQFP | |
| ISPLSI 2032A-80LT44 | Lattice Semiconductor | IC CPLD 32MC 15NS 44TQFP | ispLSI® 2000A | 0°C ~ 70°C (TA) | Tube | Surface Mount | - | - | - | - | 44-TQFP | |
| LC4064ZC-75T100I | Lattice Semiconductor | IC CPLD 64MC 7.5NS 100TQFP | ispMACH® 4000Z | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| M5LV-128/120-12YC | Lattice Semiconductor | IC CPLD 128MC 12NS 160QFP | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| ISPLSI 2032E-225LT48 | Lattice Semiconductor | IC CPLD 32MC 3.5NS 48TQFP | ispLSI® 2000E | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| LC5512MV-75FN256C | Lattice Semiconductor | IC CPLD 512MC 7.5NS 256FBGA | ispXPLD® 5000MV | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-BGA | |
| LC4256C-5TN100C | Lattice Semiconductor | IC CPLD 256MC 5NS 100TQFP | ispMACH® 4000C | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 100-LQFP |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.