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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M4A3-64/64-7VNC | Lattice Semiconductor | IC CPLD 64MC 7.5NS 100TQFP | ispMACH® 4A | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-LQFP | |
| XCR3064XL-6VQG100C | Xilinx | IC CPLD 64MC 5.5NS 100VQFP | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 100-TQFP | |
| LC4128V-27T128C | Lattice Semiconductor | IC CPLD 128MC 2.7NS 128TQFP | ispMACH® 4000V | 0°C ~ 90°C (TJ) | Tray | Surface Mount | - | - | - | - | 128-LQFP | |
| M4A3-64/32-7VNI48 | Lattice Semiconductor | IC CPLD 64MC 7.5NS 48TQFP | ispMACH® 4A | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 48-LQFP | |
| M5LV-512/120-10YC | Lattice Semiconductor | IC CPLD 512MC 10NS 160QFP | MACH® 5 | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| ISPLSI 5384VA-100LB388 | Lattice Semiconductor | IC CPLD 384MC 10NS 388BGA | ispLSI® 5000VA | 0°C ~ 70°C (TA) | Tray | Surface Mount | - | - | - | - | 388-BBGA | |
| GAL16V8D-10QP | Lattice Semiconductor | IC CPLD 8MC 10NS 20DIP | GAL®16V8 | 0°C ~ 75°C (TA) | Bulk | Through Hole | - | - | - | - | 20-DIP (0.300", 7.62mm) | |
| LC4256C-75FT256BI | Lattice Semiconductor | IC CPLD 256MC 7.5NS 256FTBG | ispMACH® 4000C | -40°C ~ 105°C (TJ) | Tray | Surface Mount | - | - | - | - | 256-LBGA | |
| M5-256/120-20YI/1 | Lattice Semiconductor | IC CPLD 256MC 20NS 160QFP | MACH® 5 | -40°C ~ 85°C (TA) | Tray | Surface Mount | - | - | - | - | 160-BQFP | |
| GAL26V12C-15LJI | Lattice Semiconductor | IC CPLD 12MC 15NS 28PLCC | GAL®26V12 | -40°C ~ 85°C (TA) | Tube | Surface Mount | - | - | - | - | 28-LCC (J-Lead) |
CPLDs are programmable logic devices that contain configurable logic blocks and interconnects similar to FPGAs but with a smaller capacity and simpler architecture. CPLDs are often used in applications requiring glue logic, interface bridging, and simple state machine implementations. They offer advantages such as fast design turnaround, low power consumption, and predictable timing characteristics, making them suitable for a wide range of embedded system designs.