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Clock/Timing - Application Specific

Clock/Timing - Application Specific

  1. Products
  2. Integrated Circuits (ICs)
  3. Clock/Timing - Application Specific
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Voltage - Supply
MPC9850VM IDT (Integrated Device Technology) IC PLL CLOCK GENERATOR 100MAPBGA - -40°C ~ 85°C Tray Surface Mount - - - - 3.135 V ~ 3.465 V
932S421CFLF IDT (Integrated Device Technology) IC PCIE GEN2 MAIN CLOCK 56-SSOP - 0°C ~ 70°C Tube Surface Mount - - - - 3.135 V ~ 3.465 V
MAX3698CTJ+T Microsemi IC CLOCK GENERATOR 32TQFN - -40°C ~ 85°C Tape & Reel (TR) Surface Mount - - - - 3 V ~ 3.6 V
SI5338A-B05709-GMR Energy Micro (Silicon Labs) I2C CONTROL, 4-OUTPUT, ANY FREQU - - Tape & Reel (TR) Surface Mount - - - - -
PI6LC48P25104LE Diodes Incorporated 156.25MHZ LVPECL SYNTHESIZER HiFlex™ -40°C ~ 85°C - Surface Mount - - - - 2.375 V ~ 3.465 V
MAX3624AETJ+T Microsemi IC CLOCK GENERATOR PREC 32TQFN - -40°C ~ 85°C Tape & Reel (TR) Surface Mount - - - - 3 V ~ 3.6 V
SI5338A-B05494-GM Energy Micro (Silicon Labs) I2C CONTROL, 4-OUTPUT, ANY FREQU - - Tray Surface Mount - - - - -
843021AGI-01LF IDT (Integrated Device Technology) IC CLK GEN 1GIG LVPECL 8-TSSOP FemtoClock® -40°C ~ 85°C Tube Surface Mount - - - - 2.375 V ~ 3.465 V
9ZXL1930BKLFT IDT (Integrated Device Technology) IC Z-BUFFER LOW POWER 72QFN - 0°C ~ 70°C Tape & Reel (TR) Surface Mount - - - - 3.135 V ~ 3.465 V
ICS557G-03T IDT (Integrated Device Technology) IC CLOCK SOURCE PCI EXP 16-TSSOP - 0°C ~ 70°C Tape & Reel (TR) Surface Mount - - - - 2.97 V ~ 3.63 V

About Clock/Timing - Application Specific


Application-specific clock and timing solutions refer to integrated circuits or modules designed to meet the unique timing requirements of specific applications or industries. These solutions may include customized timing functions, specialized interfaces, or optimized performance characteristics tailored to the target application, such as networking, telecommunications, aerospace, or automotive systems.