Invent, Innovate, Integrate
English
English
Deutsch
Français
Español
Italiano
中文
हिन्दी
Lietuviškai
Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 9DBL411BKILFT | IDT (Integrated Device Technology) | IC FAN/BUFFER DIFF 20-VFQFPN | - | -40°C ~ 85°C | Tape & Reel (TR) | Surface Mount | - | - | - | - | 3 V ~ 3.6 V | |
| ZL30314GKG | Microsemi | IC TIMING-OVER-PACKET 256TEBGA-2 | - | -40°C ~ 85°C | Tray | Surface Mount | - | - | - | - | - | |
| ZL30255LFG7 | Microsemi | DUAL-CHANNEL ANY-TO-ANY CLOCK MU | - | -40°C ~ 85°C | Tray | Surface Mount | - | - | - | - | - | |
| 9ZXL1530BKLFT | IDT (Integrated Device Technology) | IC Z-BUFFER LOW POWER 64QFN | - | 0°C ~ 70°C | Tape & Reel (TR) | Surface Mount | - | - | - | - | 3.135 V ~ 3.465 V | |
| SI5338P-B04351-GMR | Energy Micro (Silicon Labs) | I2C CONTROL, 4-OUTPUT, ANY FREQU | - | - | Tape & Reel (TR) | Surface Mount | - | - | - | - | - | |
| CY2318ANZPVXC-11 | Cypress Semiconductor | IC CLK BUFF 18OUT SDRAM 48SSOP | - | 0°C ~ 70°C | Tube | Surface Mount | - | - | - | - | 3.135 V ~ 3.465 V | |
| SI52204-A02AGM | Energy Micro (Silicon Labs) | 1.5-1.8V 4-OUTPUT PCIE GEN1/2/3/ | - | - | - | - | RoHS Compliant | - | - | - | - | |
| 9DBU0431AKLF | IDT (Integrated Device Technology) | IC BUFFER 4OUTPUT 1.5V 32MLF | - | 0°C ~ 70°C | Tray | Surface Mount | - | - | - | - | 1.425 V ~ 1.575 V | |
| SI5338B-B08601-GM | Energy Micro (Silicon Labs) | I2C CONTROL, 4-OUTPUT, ANY FREQU | - | - | Tray | Surface Mount | - | - | - | - | - | |
| SI5338B-B04183-GMR | Energy Micro (Silicon Labs) | I2C CONTROL, 4-OUTPUT, ANY FREQU | - | - | Tape & Reel (TR) | Surface Mount | - | - | - | - | - |
Application-specific clock and timing solutions refer to integrated circuits or modules designed to meet the unique timing requirements of specific applications or industries. These solutions may include customized timing functions, specialized interfaces, or optimized performance characteristics tailored to the target application, such as networking, telecommunications, aerospace, or automotive systems.