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Clock/Timing - Application Specific

Clock/Timing - Application Specific

  1. Products
  2. Integrated Circuits (ICs)
  3. Clock/Timing - Application Specific
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Voltage - Supply
AD9549ABCPZ ADI (Analog Devices, Inc.) IC CLOCK GEN/SYNCHRONIZR 64LFCSP - -40°C ~ 85°C Tray Surface Mount - - - - 1.71 V ~ 3.465 V
XRT8001IP-F Exar Corporation IC WAN CLOCK E1/E1 DUAL 18DIP - -40°C ~ 85°C Tube Through Hole - - - - 3.3 V ~ 5 V
9DBU0441AKLF IDT (Integrated Device Technology) IC BUFFER 4OUTPUT 1.5V 32MLF - 0°C ~ 70°C Tray Surface Mount - - - - 1.425 V ~ 1.575 V
SI52111-B6-GTR Energy Micro (Silicon Labs) IC CLOCK GENERATOR PCIE 8TSSOP - -40°C ~ 85°C Tape & Reel (TR) Surface Mount - - - - 2.97 V ~ 3.63 V
AD9548BCPZ ADI (Analog Devices, Inc.) IC CLOCK GEN/SYNCHRONIZR 88LFCSP - -40°C ~ 85°C Tray Surface Mount - - - - 1.71 V ~ 3.465 V
SI5338K-A-GM Energy Micro (Silicon Labs) IC CLK GEN I2C BUS PROG 24QFN MultiSynth™ -40°C ~ 85°C Tray Surface Mount - - - - 1.71 V ~ 3.63 V
PCK857DGG,512 NXP Semiconductors / Freescale IC CLK BUF DDR 167MHZ 1CIRC - 0°C ~ 85°C Tube Surface Mount - - - - 2.3 V ~ 2.7 V
MPC9109AC IDT (Integrated Device Technology) IC CLK FANOUT BUFFER 1:18 32LQFP - 0°C ~ 70°C Tray Surface Mount - - - - 2.375 V ~ 3.465 V
9DB833AGILF IDT (Integrated Device Technology) IC CLK FANOUT/BUFF ZD 48TSSOP - -40°C ~ 85°C Tube Surface Mount - - - - 3.135 V ~ 3.465 V
ICS9LPR363DGLFT IDT (Integrated Device Technology) IC PC MAIN CLOCK CK505 64-TSSOP TCH™ 0°C ~ 70°C Tape & Reel (TR) Surface Mount - - - - 3.3V

About Clock/Timing - Application Specific


Application-specific clock and timing solutions refer to integrated circuits or modules designed to meet the unique timing requirements of specific applications or industries. These solutions may include customized timing functions, specialized interfaces, or optimized performance characteristics tailored to the target application, such as networking, telecommunications, aerospace, or automotive systems.