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Clock/Timing - Application Specific

Clock/Timing - Application Specific

  1. Products
  2. Integrated Circuits (ICs)
  3. Clock/Timing - Application Specific
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Voltage - Supply
82V3280EQG8 IDT (Integrated Device Technology) IC PLL WAN SE STRATUM 2 100TQFP - -40°C ~ 85°C Tape & Reel (TR) Surface Mount - - - - 3 V ~ 3.6 V
874003AG-02LF IDT (Integrated Device Technology) IC JITTER ATTENUATOR 20-TSSOP FemtoClock® 0°C ~ 70°C Tube Surface Mount - - - - 3.135 V ~ 3.465 V
9DB423BGLF IDT (Integrated Device Technology) IC PC CLOCK 3.3V 28-TSSOP - 0°C ~ 70°C Tube Surface Mount - - - - 3.135 V ~ 3.465 V
SL28541BQCRT Energy Micro (Silicon Labs) IC CLOCK CK505 MOBILE 64QFN - 0°C ~ 85°C Tape & Reel (TR) Surface Mount - - - - 3.135 V ~ 3.465 V
93716BFLFT IDT (Integrated Device Technology) IC CLK BUF DDR 233MHZ 1CIRC - 0°C ~ 85°C Tape & Reel (TR) Surface Mount - - - - 2.3 V ~ 2.7 V
5V41235NLGI8 IDT (Integrated Device Technology) IC CLK GEN SPRED SPECTRM 16MLF - -40°C ~ 85°C Tape & Reel (TR) Surface Mount - - - - 3.135 V ~ 3.465 V
PI6LC48L0201AZHIE Diodes Incorporated 2-OUTPUT LVDS NETWORKING CLOCK G - - - - - - - - -
SI5338N-B06337-GM Energy Micro (Silicon Labs) I2C CONTROL, 4-OUTPUT, ANY FREQU - - Tray Surface Mount - - - - -
IDTCV174CPAG IDT (Integrated Device Technology) IC FLEXPC CLK PROGR P4 56-TSSOP FlexPC™ 0°C ~ 70°C Tube Surface Mount - - - - 3.135 V ~ 3.465 V
SI5338N-B06312-GMR Energy Micro (Silicon Labs) I2C CONTROL, 4-OUTPUT, ANY FREQU - - Tape & Reel (TR) Surface Mount - - - - -

About Clock/Timing - Application Specific


Application-specific clock and timing solutions refer to integrated circuits or modules designed to meet the unique timing requirements of specific applications or industries. These solutions may include customized timing functions, specialized interfaces, or optimized performance characteristics tailored to the target application, such as networking, telecommunications, aerospace, or automotive systems.