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Clock/Timing - Application Specific

Clock/Timing - Application Specific

  1. Products
  2. Integrated Circuits (ICs)
  3. Clock/Timing - Application Specific
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Voltage - Supply
SI5338L-B06240-GMR Energy Micro (Silicon Labs) I2C CONTROL, 4-OUTPUT, ANY FREQU - - Tape & Reel (TR) Surface Mount - - - - -
SI5338B-B06960-GM Energy Micro (Silicon Labs) I2C CONTROL, 4-OUTPUT, ANY FREQU - - Tray Surface Mount - - - - -
9DBU0831AKLF IDT (Integrated Device Technology) IC BUFFER 8OUTPUT 1.5V 48MLF - 0°C ~ 70°C Tray Surface Mount - - - - 1.425 V ~ 1.575 V
SI5338B-A-GM Energy Micro (Silicon Labs) IC CLK GEN QUAD 350MHZ 24-QFN MultiSynth™ -40°C ~ 85°C Tray Surface Mount - - - - 1.71 V ~ 3.63 V
9LPR600CGLF IDT (Integrated Device Technology) IC TIMING CTRL HUB P4 56-TSSOP - 0°C ~ 70°C Tube Surface Mount - - - - 3.3V
874003AGLFT IDT (Integrated Device Technology) IC PCI EXPRSS/JITT ATTEN 20TSSOP FemtoClock® 0°C ~ 70°C Tape & Reel (TR) Surface Mount - - - - 3.135 V ~ 3.465 V
SI5338M-B06030-GMR Energy Micro (Silicon Labs) I2C CONTROL, 4-OUTPUT, ANY FREQU - - Tape & Reel (TR) Surface Mount - - - - -
SI5338A-B08483-GMR Energy Micro (Silicon Labs) I2C CONTROL, 4-OUTPUT, ANY FREQU - - Tape & Reel (TR) Surface Mount - - - - -
IDTCSPT857DNLG IDT (Integrated Device Technology) IC CLK BUF DDR 220MHZ 1CIRC - 0°C ~ 70°C Tray Surface Mount - - - - 2.3 V ~ 2.7 V
87604AGILF IDT (Integrated Device Technology) IC CLK MULT/ZD BUFFER 28-TSSOP - -40°C ~ 85°C Tube Surface Mount - - - - 3.135 V ~ 3.465 V

About Clock/Timing - Application Specific


Application-specific clock and timing solutions refer to integrated circuits or modules designed to meet the unique timing requirements of specific applications or industries. These solutions may include customized timing functions, specialized interfaces, or optimized performance characteristics tailored to the target application, such as networking, telecommunications, aerospace, or automotive systems.