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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SI5338F-B04078-GM | Energy Micro (Silicon Labs) | I2C CONTROL, 4-OUTPUT, ANY FREQU | - | - | Tray | Surface Mount | - | - | - | - | - | |
| SI5338C-B08176-GM | Energy Micro (Silicon Labs) | I2C CONTROL, 4-OUTPUT, ANY FREQU | - | - | Tray | Surface Mount | - | - | - | - | - | |
| 960001AFLF | IDT (Integrated Device Technology) | IC FREQ GENERATOR/BUFFER 48-SSOP | - | 0°C ~ 70°C | Tube | Surface Mount | - | - | - | - | 3.3V | |
| MSTM-S3-TR-19.44M | Connor-Winfield | IC CLK TIME MODULE ETHERNET | MSTM-S3 | 0°C ~ 50°C | Bulk | Through Hole | - | - | - | - | 4.75 V ~ 5.25 V | |
| SI5338L-B06976-GM | Energy Micro (Silicon Labs) | I2C CONTROL, 4-OUTPUT, ANY FREQU | - | - | Tray | Surface Mount | - | - | - | - | - | |
| 932S825BGLF | IDT (Integrated Device Technology) | IC CLOCK CHIP LOW POWER 64-TSSOP | - | 0°C ~ 70°C | Tube | Surface Mount | - | - | - | - | 3.135 V ~ 3.465 V | |
| IDTCV137PAG | IDT (Integrated Device Technology) | IC FLEXPC CLK AMD K8 56-TSSOP | FlexPC™ | 0°C ~ 70°C | Tube | Surface Mount | - | - | - | - | 3.135 V ~ 3.465 V | |
| SI5338A-B07774-GM | Energy Micro (Silicon Labs) | I2C CONTROL, 4-OUTPUT, ANY FREQU | - | - | Tray | Surface Mount | - | - | - | - | - | |
| MDB1900ZCQZ-TR | Micrel / Microchip Technology | BUFFER 19-OUTPUT | - | 0°C ~ 70°C | Tape & Reel (TR) | Surface Mount | - | - | - | - | 2.375 V ~ 3.465 V | |
| SI5338A-B07455-GMR | Energy Micro (Silicon Labs) | I2C CONTROL, 4-OUTPUT, ANY FREQU | - | - | Tape & Reel (TR) | Surface Mount | - | - | - | - | - |
Application-specific clock and timing solutions refer to integrated circuits or modules designed to meet the unique timing requirements of specific applications or industries. These solutions may include customized timing functions, specialized interfaces, or optimized performance characteristics tailored to the target application, such as networking, telecommunications, aerospace, or automotive systems.