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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 9DB403DFILFT | IDT (Integrated Device Technology) | IC BUFFER 4OUTPUT DIFF 28-SSOP | - | -40°C ~ 85°C | Tape & Reel (TR) | Surface Mount | - | - | - | - | 3.135 V ~ 3.465 V | |
| 9DB403DGILFT | IDT (Integrated Device Technology) | IC BUFFER 4OUTPUT DIFF 28-TSSOP | - | -40°C ~ 85°C | Tape & Reel (TR) | Surface Mount | - | - | - | - | 3.135 V ~ 3.465 V | |
| 9DBL1200AGLF | IDT (Integrated Device Technology) | IC PC CLOCK 3.3V 64-TSSOP | - | 0°C ~ 70°C | Tube | Surface Mount | - | - | - | - | 3.135 V ~ 3.465 V | |
| SI5338N-B07867-GM | Energy Micro (Silicon Labs) | I2C CONTROL, 4-OUTPUT, ANY FREQU | - | - | Tray | Surface Mount | - | - | - | - | - | |
| SI5338L-B04358-GMR | Energy Micro (Silicon Labs) | I2C CONTROL, 4-OUTPUT, ANY FREQU | - | - | Tape & Reel (TR) | Surface Mount | - | - | - | - | - | |
| CY2318ANZPVC-11 | Cypress Semiconductor | IC CLK BUFF 18OUT SDRAM 48SSOP | - | 0°C ~ 70°C | Tube | Surface Mount | - | - | - | - | 3.135 V ~ 3.465 V | |
| SI5338Q-B02173-GM | Energy Micro (Silicon Labs) | I2C CONTROL, 4-OUTPUT, ANY FREQU | - | - | Tray | Surface Mount | - | - | - | - | - | |
| 5V41064NLG8 | IDT (Integrated Device Technology) | IC CLOCK BUFFER ZD 2.5V 16QFN | - | 0°C ~ 70°C | Tape & Reel (TR) | Surface Mount | - | - | - | - | 3.135 V ~ 3.465 V | |
| SI5338B-B07975-GM | Energy Micro (Silicon Labs) | I2C CONTROL, 4-OUTPUT, ANY FREQU | - | - | Tray | Surface Mount | - | - | - | - | - | |
| ICS95V857AK | IDT (Integrated Device Technology) | IC CLK BUF DDR 233MHZ 1CIRC | - | 0°C ~ 85°C | Tray | Surface Mount | - | - | - | - | 2.3 V ~ 2.7 V |
Application-specific clock and timing solutions refer to integrated circuits or modules designed to meet the unique timing requirements of specific applications or industries. These solutions may include customized timing functions, specialized interfaces, or optimized performance characteristics tailored to the target application, such as networking, telecommunications, aerospace, or automotive systems.