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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type | Lead Free Status | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 9EX21531AKLFT | IDT (Integrated Device Technology) | IC FANOUT/BUFFER DIFF 64QFPN | - | 0°C ~ 70°C | Tape & Reel (TR) | Surface Mount | - | - | - | - | 3.135 V ~ 3.465 V | |
| CY22800FXC-034A | Cypress Semiconductor | IC PROG CLOCK GEN 8-SOIC | - | 0°C ~ 70°C | Tube | Surface Mount | - | - | - | - | 3.14 V ~ 3.47 V | |
| SI5334C-B07041-GM | Energy Micro (Silicon Labs) | 4-OUTPUT, ANY FREQUENCY(<200MHZ) | - | - | Tray | Surface Mount | - | - | - | - | - | |
| ICS954148AGLFT | IDT (Integrated Device Technology) | IC TIMING CTRL HUB P4 56-TSSOP | - | 0°C ~ 70°C | Tape & Reel (TR) | Surface Mount | - | - | - | - | 3.3V | |
| SI5338B-B04560-GM | Energy Micro (Silicon Labs) | I2C CONTROL, 4-OUTPUT, ANY FREQU | - | - | Tray | Surface Mount | - | - | - | - | - | |
| PT7C5027C1-5BUWF | Diodes Incorporated | IC CLOCKING XO | - | - | - | - | - | - | - | - | - | |
| IDTCV110NPAG8 | IDT (Integrated Device Technology) | IC FLEXPC CLK PROGR P4 56-TSSOP | FlexPC™ | 0°C ~ 70°C | Tape & Reel (TR) | Surface Mount | - | - | - | - | 3.135 V ~ 3.465 V | |
| ICS932S806CGLF | IDT (Integrated Device Technology) | IC K8 CLOCK CHIP 64-TSSOP | - | 0°C ~ 70°C | Tube | Surface Mount | - | - | - | - | 3.3V | |
| SI5338C-B06043-GMR | Energy Micro (Silicon Labs) | I2C CONTROL, 4-OUTPUT, ANY FREQU | - | - | Tape & Reel (TR) | Surface Mount | - | - | - | - | - | |
| CSPT855PGG8 | IDT (Integrated Device Technology) | IC CLK BUF DDR 220MHZ 1CIRC | - | 0°C ~ 70°C | Tape & Reel (TR) | Surface Mount | - | - | - | - | 2.3 V ~ 2.7 V |
Application-specific clock and timing solutions refer to integrated circuits or modules designed to meet the unique timing requirements of specific applications or industries. These solutions may include customized timing functions, specialized interfaces, or optimized performance characteristics tailored to the target application, such as networking, telecommunications, aerospace, or automotive systems.