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Clock/Timing - Application Specific

Clock/Timing - Application Specific

  1. Products
  2. Integrated Circuits (ICs)
  3. Clock/Timing - Application Specific
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Voltage - Supply
557G-06LFT IDT (Integrated Device Technology) IC CLK BUFFER 1:4 HCSL 20-TSSOP - 0°C ~ 70°C Tape & Reel (TR) Surface Mount - - - - 3.135 V ~ 3.465 V
SI5338N-B06336-GMR Energy Micro (Silicon Labs) I2C CONTROL, 4-OUTPUT, ANY FREQU - - Tape & Reel (TR) Surface Mount - - - - -
SI5338C-B02273-GM Energy Micro (Silicon Labs) I2C CONTROL, 4-OUTPUT, ANY FREQU - - Tray Surface Mount - - - - -
ZL30230GGG2 Microsemi IC CLK TRANSLATOR 4CH 100LBGA - -40°C ~ 85°C Tray Surface Mount - - - - -
SI5338B-B03506-GMR Energy Micro (Silicon Labs) I2C CONTROL, 4-OUTPUT, ANY FREQU - - Tape & Reel (TR) Surface Mount - - - - -
8741004AGLFT IDT (Integrated Device Technology) IC PCI EXPRSS/JITT ATTEN 24TSSOP FemtoClock® 0°C ~ 70°C Tape & Reel (TR) Surface Mount - - - - 3.135 V ~ 3.465 V
ICS932S200BFLF IDT (Integrated Device Technology) IC FREQ TIMING GENERATOR 56-SSOP - 0°C ~ 70°C Tube Surface Mount - - - - 3.135 V ~ 3.465 V
843021AGI-01T IDT (Integrated Device Technology) IC CLK GENERATOR LVPECL 8-TSSOP FemtoClock® -40°C ~ 85°C Tape & Reel (TR) Surface Mount - - - - 2.375 V ~ 3.465 V
SI5338A-B01603-GM Energy Micro (Silicon Labs) I2C CONTROL, 4-OUTPUT, ANY FREQU - - Tray Surface Mount - - - - -
CY28410OXC-2 Energy Micro (Silicon Labs) IC CLOCK CK410 GRANTSDALE 56SSOP - 0°C ~ 70°C Tube Surface Mount - - - - 3.135 V ~ 3.465 V

About Clock/Timing - Application Specific


Application-specific clock and timing solutions refer to integrated circuits or modules designed to meet the unique timing requirements of specific applications or industries. These solutions may include customized timing functions, specialized interfaces, or optimized performance characteristics tailored to the target application, such as networking, telecommunications, aerospace, or automotive systems.