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Clock/Timing - Application Specific

Clock/Timing - Application Specific

  1. Products
  2. Integrated Circuits (ICs)
  3. Clock/Timing - Application Specific
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Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Lead Free Status Voltage - Supply
9FGU0441AKILF IDT (Integrated Device Technology) IC CLK GEN PCIE 4OP 1.5V 32VQFPN - -40°C ~ 85°C Tray Surface Mount - - - - 1.425 V ~ 1.575 V
9250BF-27LFT IDT (Integrated Device Technology) IC FREQ GENERATOR/BUFFER 56-SSOP - 0°C ~ 70°C Tape & Reel (TR) Surface Mount - - - - 3.135 V ~ 3.465 V
IDTCV110NPAG IDT (Integrated Device Technology) IC FLEXPC CLK PROGR P4 56-TSSOP FlexPC™ 0°C ~ 70°C Tube Surface Mount - - - - 3.135 V ~ 3.465 V
SI52202-A01AGM Energy Micro (Silicon Labs) CLOCK GENERATOR - -40°C ~ 85°C Tube Surface Mount - - - - 1.5 V ~ 1.8 V
ICS953401CGT IDT (Integrated Device Technology) IC TIMING CTRL HUB P4 56-TSSOP - 0°C ~ 70°C Tape & Reel (TR) Surface Mount - - - - 3.3V
CY28346OXC Energy Micro (Silicon Labs) IC CLK FREQ SYNC CPU 200MHZ - 0°C ~ 70°C Tube Surface Mount - - - - 3.135 V ~ 3.465 V
SI5338A-B02180-GMR Energy Micro (Silicon Labs) I2C CONTROL, 4-OUTPUT, ANY FREQU - - Tape & Reel (TR) Surface Mount - - - - -
SI5338A-B04406-GMR Energy Micro (Silicon Labs) I2C CONTROL, 4-OUTPUT, ANY FREQU - - Tape & Reel (TR) Surface Mount - - - - -
SL28EB740AZI Energy Micro (Silicon Labs) IC CLK CK505 TNLCK/TPCLF 56TSSOP EProClock® -40°C ~ 85°C Tube Surface Mount - - - - 3.135 V ~ 3.465 V
SI5334M-B04346-GM Energy Micro (Silicon Labs) 4-OUTPUT, ANY FREQUENCY(<200MHZ) - - Tray Surface Mount - - - - -

About Clock/Timing - Application Specific


Application-specific clock and timing solutions refer to integrated circuits or modules designed to meet the unique timing requirements of specific applications or industries. These solutions may include customized timing functions, specialized interfaces, or optimized performance characteristics tailored to the target application, such as networking, telecommunications, aerospace, or automotive systems.