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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Mounting Type | Housing Material | Termination | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 612-41-322-41-001000 | Mill-Max | SKT CARRIER SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 123-93-320-41-001000 | Mill-Max | CONN IC DIP SOCKET 20POS GOLD | 123 | -55°C ~ 125°C | Open Frame | 3A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Wire Wrap | - | - | |
| 522-13-012-05-001001 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - | |
| 16-8530-310C | Aries Electronics, Inc. | CONN IC DIP SOCKET 16POS GOLD | 8 | -55°C ~ 105°C | Closed Frame, Elevated | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Solder | - | - | |
| 110-83-320-41-530000 | Mill-Max | CONN IC SKT DBL | - | - | - | - | - | - | - | - | - | |
| 1-1571995-0 | Agastat Relays / TE Connectivity | CONN SOCKET SIP 10POS TIN | 510 | - | Closed Frame | - | Through Hole | Thermoplastic, Polyester | Solder | - | - | |
| 116-83-320-41-003101 | Preci-Dip | CONN IC DIP SOCKET 20POS GOLD | 116 | -55°C ~ 125°C | Elevated, Open Frame | 1A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Solder | - | - | |
| 510-91-064-08-000001 | Mill-Max | SKT PGA SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 510-13-088-13-062001 | Mill-Max | SKT PGA SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 116-93-316-61-008000 | Mill-Max | CONN IC SKT DBL | - | - | - | - | - | - | - | - | - |
Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.