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Sockets for ICs, Transistors

Sockets for ICs, Transistors

  1. Products
  2. Connectors, Interconnects
  3. Sockets for ICs, Transistors
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Series
Operating Temperature
Features
Current Rating
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Image Part Number Manufacturer Description Series Operating Temperature Features Current Rating Mounting Type Housing Material Termination Convert To (Adapter End) Convert From (Adapter End)
346-43-109-41-013000 Mill-Max CONN SOCKET SIP 9POS GOLD 346 -55°C ~ 125°C - 3A Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Press-Fit - -
511-91-028-06-005003 Mill-Max SKT PGA SOLDRTL - - - - - - - - -
37-0508-20 Aries Electronics, Inc. CONN SOCKET SIP 37POS GOLD 508 -55°C ~ 105°C - 3A Through Hole Polyamide (PA46), Nylon 4/6 Wire Wrap - -
511-93-084-10-031002 Mill-Max SKT PGA SOLDRTL - - - - - - - - -
116-43-432-41-007000 Mill-Max CONN IC SKT DBL - - - - - - - - -
36-3570-10 Aries Electronics, Inc. CONN IC DIP SOCKET ZIF 36POS TIN 57 - Closed Frame 1A Through Hole Polyphenylene Sulfide (PPS), Glass Filled Solder - -
110-43-328-10-002000 Mill-Max CONN IC DIP SOCKET 28POS GOLD 110 -55°C ~ 125°C Open Frame 3A Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Solder - -
D95B24-42 Harwin CONN IC DIP SOCKET 24POS GOLD D95 -55°C ~ 125°C Elevated, Open Frame 1A Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled Solder - -
614-91-304-31-007000 Mill-Max SKT CARRIER PGA - - - - - - - - -
232-1270-01-0602 3M CONN SOCKET PGA ZIF 32POS GOLD Textool™ -55°C ~ 125°C Closed Frame 1A Through Hole Polysulfone (PSU), Glass Filled Solder - -

About Sockets for ICs, Transistors


Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.