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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Mounting Type | Housing Material | Termination | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2-1814655-7 | Agastat Relays / TE Connectivity | CONN SOCKET SIP 32POS GOLD | - | -55°C ~ 125°C | Closed Frame | 1A | Through Hole | Thermoplastic, Polyester | Solder | - | - | |
| 4-1437538-4 | Agastat Relays / TE Connectivity | CONN IC DIP SOCKET 48POS TINLEAD | 800 | -55°C ~ 105°C | Open Frame | 3A | Through Hole | Polyester | Solder | - | - | |
| 116-91-652-41-007000 | Mill-Max | CONN IC SKT DBL | - | - | - | - | - | - | - | - | - | |
| 523-93-036-06-000002 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - | |
| 110-93-628-41-605000 | Mill-Max | CONN IC DIP SOCKET 28POS GOLD | 110 | -55°C ~ 125°C | Open Frame | 3A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Solder | - | - | |
| 14-6503-30 | Aries Electronics, Inc. | CONN IC DIP SOCKET 14POS GOLD | 503 | -55°C ~ 105°C | Closed Frame | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Wire Wrap | - | - | |
| 100-PLS17048-12 | Aries Electronics, Inc. | CONN SOCKET PGA ZIF GOLD | PLS | -65°C ~ 125°C | Closed Frame | 1A | Through Hole | Polyphenylene Sulfide (PPS) | Solder | - | - | |
| 110-93-308-41-001000 | Mill-Max | CONN IC DIP SOCKET 8POS GOLD | 110 | -55°C ~ 125°C | Open Frame | 3A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Solder | - | - | |
| ICO-640-SGT | Samtec, Inc. | CONN IC DIP SOCKET 40POS GOLD | ICO | -55°C ~ 125°C | Open Frame | 1A | Through Hole | Polyester, Glass Filled | Solder | - | - | |
| 522-93-064-08-000003 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - |
Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.