| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 48-6518-10E | Aries Electronics, Inc. | CONN IC DIP SOCKET 48POS GOLD | 518 | - | Open Frame | 3A | Bulk | Through Hole | - | - | DIP, 0.6" (15.24mm) Row Spacing | |
| 116-93-642-41-008000 | Mill-Max | CONN IC DIP SOCKET 42POS GOLD | 116 | -55°C ~ 125°C | Elevated, Open Frame | 3A | Tube | Through Hole | - | - | DIP, 0.6" (15.24mm) Row Spacing | |
| 510-93-181-14-031003 | Mill-Max | SKT PGA SOLDRTL | - | - | - | - | - | - | RoHS non-compliant | - | - | |
| 510-87-175-16-071101 | Preci-Dip | CONN SOCKET PGA 175POS GOLD | 510 | -55°C ~ 125°C | Open Frame | 1A | Bulk | Through Hole | - | - | PGA | |
| 09-0518-10 | Aries Electronics, Inc. | CONN SOCKET SIP 9POS GOLD | 518 | - | Open Frame | 3A | Bulk | Through Hole | - | - | SIP | |
| 117-43-430-61-005000 | Mill-Max | CONN IC SKT DBL | - | - | - | - | - | - | RoHS Compliant | - | - | |
| 241-20-1-03 | CNC Tech | CONN IC DIP SOCKET 20POS TIN | - | -40°C ~ 105°C | Open Frame | 1A | Tube | Through Hole | - | - | DIP, 0.3" (7.62mm) Row Spacing | |
| 116-91-314-41-007000 | Mill-Max | CONN IC SKT DBL | - | - | - | - | - | - | RoHS non-compliant | - | - | |
| 551-90-225-18-091005 | Mill-Max | CONN HDR SOLDRTL | - | - | - | - | - | - | RoHS non-compliant | - | - | |
| 48-6556-40 | Aries Electronics, Inc. | CONN IC DIP SOCKET 48POS GOLD | 6556 | - | Open Frame | 3A | Bulk | Through Hole | - | - | DIP, 0.6" (15.24mm) Row Spacing |
Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.