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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Mounting Type | Housing Material | Termination | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ICO-083-S8-T | 3M | CONN IC DIP SOCKET 8POS TIN | ICO | -65°C ~ 105°C | Open Frame | 1A | Through Hole | Polyester, Glass Filled | Solder | - | - | |
| 84-536-11 | Aries Electronics, Inc. | CONN SOCKET PLCC ZIF 84POS GOLD | 536 | - | Open Frame | - | Through Hole | - | - | - | - | |
| 210-44-306-41-001000 | Mill-Max | STANDRD SOLDRTL DBL SKT | - | - | - | - | - | - | - | - | - | |
| 522-13-281-19-081003 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - | |
| 4-1437532-7 | Agastat Relays / TE Connectivity | CONN IC DIP SOCKET 28POS | 500 | - | Closed Frame | - | Through Hole | - | - | - | - | |
| 346-43-108-41-013000 | Mill-Max | CONN SOCKET SIP 8POS GOLD | 346 | -55°C ~ 125°C | - | 3A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Press-Fit | - | - | |
| 1-345830-1 | Agastat Relays / TE Connectivity | CONN IC DIP SOCKET 16POS GOLD | - | - | Closed Frame | - | Through Hole, Right Angle, Vertical | - | - | - | - | |
| 614-87-328-41-001101 | Preci-Dip | CONN IC DIP SOCKET 28POS GOLD | 614 | -55°C ~ 125°C | Carrier, Open Frame | 1A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Solder | - | - | |
| 518-77-480M29-001105 | Preci-Dip | CONN SOCKET PGA 480POS GOLD | 518 | -55°C ~ 125°C | Open Frame | 1A | Through Hole | FR4 Epoxy Glass | Solder | - | - | |
| 14-8870-310C | Aries Electronics, Inc. | CONN IC DIP SOCKET 14POS GOLD | 8 | -55°C ~ 105°C | Closed Frame, Elevated | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Solder | - | - |
Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.