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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Mounting Type | Housing Material | Termination | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 523-13-073-11-042003 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - | |
| 116-83-210-41-013101 | Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 116 | -55°C ~ 125°C | Elevated, Open Frame | 1A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Solder | - | - | |
| 123-11-308-41-001000 | Mill-Max | CONN IC SKT DBL | - | - | - | - | - | - | - | - | - | |
| 121-13-652-41-001000 | Mill-Max | CONN IC DIP SOCKET 52POS GOLD | 121 | -55°C ~ 125°C | Open Frame | 3A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Wire Wrap | - | - | |
| 612-43-964-41-003000 | Mill-Max | SKT CARRIER SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 40-6571-11 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 40POS GLD | 57 | - | Closed Frame | 1A | Through Hole | Polyphenylene Sulfide (PPS), Glass Filled | Solder | - | - | |
| 515-13-225-18-091001 | Mill-Max | SKT PGA SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 14-8540-310C | Aries Electronics, Inc. | CONN IC DIP SOCKET 14POS GOLD | 8 | -55°C ~ 105°C | Closed Frame, Elevated | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Solder | - | - | |
| WMS-080Z | On-Shore Technology, Inc. | CONN IC DIP SOCKET 8POS GOLD | WMS | -40°C ~ 105°C | Open Frame, Wash Away | 3A | Through Hole | - | Solder | - | - | |
| 550-80-132-14-071101 | Preci-Dip | PGA SOLDER TAIL | 550 | -55°C ~ 125°C | Open Frame | 1A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Solder | - | - |
Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.