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Sockets for ICs, Transistors

Sockets for ICs, Transistors

  1. Products
  2. Connectors, Interconnects
  3. Sockets for ICs, Transistors
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Image Part Number Manufacturer Description Series Operating Temperature Features Current Rating Mounting Type Housing Material Termination Convert To (Adapter End) Convert From (Adapter End)
116-87-636-41-018101 Preci-Dip CONN IC DIP SOCKET 36POS GOLD 116 -55°C ~ 125°C Elevated, Open Frame 1A Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Solder - -
210-43-632-41-001000 Mill-Max CONN IC DIP SOCKET 32POS GOLD 210 -55°C ~ 125°C Closed Frame 3A Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Solder - -
110-43-642-41-001000 Mill-Max CONN IC SKT DBL - - - - - - - - -
110-47-328-41-001000 Mill-Max CONN IC DIP SOCKET 28POS GOLD 110 -55°C ~ 125°C Open Frame 3A Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Solder - -
117-87-640-41-005101 Preci-Dip CONN IC DIP SOCKET 40POS GOLD 117 -55°C ~ 125°C Open Frame 1A Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Solder - -
116-83-632-41-018101 Preci-Dip CONN IC DIP SOCKET 32POS GOLD 116 -55°C ~ 125°C Elevated, Open Frame 1A Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Solder - -
126-41-318-41-002000 Mill-Max CONN IC SKT DBL - - - - - - - - -
40-3554-10 Aries Electronics, Inc. CONN IC DIP SOCKET ZIF 40POS TIN 55 - Closed Frame 1A Through Hole Polyphenylene Sulfide (PPS), Glass Filled Solder - -
18-3508-212 Aries Electronics, Inc. CONN IC DIP SOCKET 18POS GOLD 508 -55°C ~ 125°C Open Frame 3A Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Wire Wrap - -
614-13-169-17-101007 Mill-Max SKT CARRIER PGA - - - - - - - - -

About Sockets for ICs, Transistors


Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.