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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Mounting Type | Housing Material | Termination | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 551-90-169-13-000003 | Mill-Max | CONN HDR SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 515-91-068-10-041003 | Mill-Max | SKT PGA SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 69802-144LF | Amphenol FCI | CONN SOCKET PLCC 44POS TIN | - | -55°C ~ 125°C | Closed Frame | 1A | Surface Mount | Polyphenylene Sulfide (PPS) | Solder | - | - | |
| 515-91-045-08-005002 | Mill-Max | SKT PGA SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 64-9508-20 | Aries Electronics, Inc. | CONN IC DIP SOCKET 64POS GOLD | 508 | -55°C ~ 105°C | Open Frame | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Wire Wrap | - | - | |
| 34-0508-21 | Aries Electronics, Inc. | CONN SOCKET SIP 34POS GOLD | 508 | -55°C ~ 125°C | - | 3A | Through Hole | Polyamide (PA46), Nylon 4/6 | Wire Wrap | - | - | |
| 126-93-304-41-001000 | Mill-Max | CONN IC DIP SOCKET 4POS GOLD | 126 | -55°C ~ 125°C | Open Frame | 3A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Wire Wrap | - | - | |
| 36-3570-16 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 36POS | 57 | - | Closed Frame | 1A | Through Hole | Polyphenylene Sulfide (PPS), Glass Filled | Solder | - | - | |
| 104-13-648-41-780000 | Mill-Max | CONN IC DIP SOCKET 48POS GOLD | 104 | - | Open Frame | 3A | Through Hole | Thermoplastic | Press-Fit | - | - | |
| 116-87-428-41-018101 | Preci-Dip | CONN IC DIP SOCKET 28POS GOLD | 116 | -55°C ~ 125°C | Elevated, Open Frame | 1A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Solder | - | - |
Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.