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Sockets for ICs, Transistors

Sockets for ICs, Transistors

  1. Products
  2. Connectors, Interconnects
  3. Sockets for ICs, Transistors
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Image Part Number Manufacturer Description Series Operating Temperature Features Current Rating Mounting Type Housing Material Termination Convert To (Adapter End) Convert From (Adapter End)
04-822-90C Aries Electronics, Inc. CONN IC DIP SOCKET 4POS GOLD Vertisockets™ 800 -55°C ~ 105°C Closed Frame 3A Through Hole, Right Angle, Horizontal Polyamide (PA46), Nylon 4/6, Glass Filled Solder - -
1-1825093-4 Agastat Relays / TE Connectivity CONN IC DIP SOCKET 16POS GOLD Diplomate DL -55°C ~ 125°C Open Frame - Through Hole Thermoplastic, Glass Filled Solder - -
12-6503-31 Aries Electronics, Inc. CONN IC DIP SOCKET 12POS GOLD 503 -55°C ~ 125°C Closed Frame 3A Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Wire Wrap - -
551-90-084-12-051003 Mill-Max CONN HDR SOLDRTL - - - - - - - - -
116-93-318-41-003000 Mill-Max CONN IC DIP SOCKET 18POS GOLD 116 -55°C ~ 125°C Elevated, Open Frame 3A Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Solder - -
116-41-328-41-001000 Mill-Max CONN IC SKT DBL - - - - - - - - -
515-91-173-16-005002 Mill-Max SKT PGA SOLDRTL - - - - - - - - -
110-43-324-41-801000 Mill-Max CONN IC DIP SOCKET 24POS GOLD 110 -55°C ~ 125°C Open Frame, Decoupling Capacitor 3A Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Solder - -
940-44-084-17-400000 Mill-Max CONN SOCKET PLCC 84POS TIN 940 -55°C ~ 125°C Closed Frame 1A Surface Mount Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Solder - -
346-93-162-41-013000 Mill-Max CONN SOCKET SIP 62POS GOLD 346 -55°C ~ 125°C - 3A Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Press-Fit - -

About Sockets for ICs, Transistors


Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.