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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Mounting Type | Housing Material | Termination | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 614-93-155-18-121001 | Mill-Max | SKT CARRIER PGA | - | - | - | - | - | - | - | - | - | |
| 48-6556-20 | Aries Electronics, Inc. | CONN IC DIP SOCKET 48POS GOLD | 6556 | - | Open Frame | 3A | Through Hole | Polyphenylene Sulfide (PPS), Glass Filled | Wire Wrap | - | - | |
| 28-3573-16 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 28POS | 57 | - | Closed Frame | 1A | Through Hole | Polyphenylene Sulfide (PPS), Glass Filled | Solder | - | - | |
| 299-83-318-10-001101 | Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 299 | -55°C ~ 125°C | Closed Frame | 1A | Through Hole, Right Angle, Horizontal | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Solder | - | - | |
| 110-87-306-41-105161 | Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 110 | -55°C ~ 125°C | Open Frame | 1A | Surface Mount | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Solder | - | - | |
| 551-90-049-07-000003 | Mill-Max | CONN HDR SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 714-43-155-31-018000 | Mill-Max | CONN SOCKET SIP 55POS GOLD | 714 | -55°C ~ 125°C | Carrier | 3A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Solder | - | - | |
| 523-93-076-11-041001 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - | |
| XR2C1011N | Omron | CONN SOCKET SIP 10POS GOLD | XR2 | -55°C ~ 125°C | - | 1A | Threaded | Polybutylene Terephthalate (PBT), Glass Filled | Solder | - | - | |
| 511-93-092-11-041002 | Mill-Max | SKT PGA SOLDRTL | - | - | - | - | - | - | - | - | - |
Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.