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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Mounting Type | Housing Material | Termination | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 523-13-085-13-081001 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - | |
| 5-6437508-1 | Agastat Relays / TE Connectivity | CONN SOCKET TRANSIST TO-5 | - | - | - | - | - | - | - | - | - | |
| 32-3575-18 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 32POS | 57 | - | Closed Frame | 1A | Through Hole | Polyphenylene Sulfide (PPS), Glass Filled | Solder | - | - | |
| 16-823-90TWR | Aries Electronics, Inc. | CONN IC DIP SOCKET 16POS TIN | Vertisockets™ 800 | - | Closed Frame | 1.5A | Through Hole, Right Angle, Horizontal | Polyamide (PA46), Nylon 4/6 | Solder | - | - | |
| 121-83-314-41-001101 | Preci-Dip | CONN IC DIP SOCKET 14POS GOLD | 121 | -55°C ~ 125°C | Open Frame | 1A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Wire Wrap | - | - | |
| 514-87-360M19-001148 | Preci-Dip | CONN SOCKET BGA 360POS GOLD | 514 | -55°C ~ 125°C | Open Frame | 1A | Surface Mount | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Solder | - | - | |
| 808-AG11D-ES | Agastat Relays / TE Connectivity | CONN IC DIP SOCKET 8POS GOLD | 800 | -55°C ~ 105°C | Open Frame | 3A | Through Hole | Polyester | Solder | - | - | |
| 522-93-085-11-041003 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - | |
| 22-0511-11 | Aries Electronics, Inc. | CONN SOCKET SIP 22POS GOLD | 511 | -55°C ~ 125°C | - | 1A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Solder | - | - | |
| 515-93-096-14-085001 | Mill-Max | SKT PGA SOLDRTL | - | - | - | - | - | - | - | - | - |
Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.