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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Mounting Type | Housing Material | Termination | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 522-93-240-17-061003 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - | |
| 8058-1G31 | Agastat Relays / TE Connectivity | CONN TRANSIST TO-5 10POS GOLD | 8058 | -55°C ~ 125°C | Closed Frame | - | Through Hole | Polytetrafluoroethylene (PTFE) | Solder | - | - | |
| 116-83-420-41-008101 | Preci-Dip | CONN IC DIP SOCKET 20POS GOLD | 116 | -55°C ~ 125°C | Elevated, Open Frame | 1A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Solder | - | - | |
| 28-6571-10 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 28POS TIN | 57 | - | Closed Frame | 1A | Through Hole | Polyphenylene Sulfide (PPS), Glass Filled | Solder | - | - | |
| 510-AG90D-10 | Agastat Relays / TE Connectivity | CONN SOCKET SIP 10POS GOLD | 500 | - | - | - | Through Hole | Thermoplastic | Solder | - | - | |
| 16-0518-11 | Aries Electronics, Inc. | CONN SOCKET SIP 16POS GOLD | 518 | - | Open Frame | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Solder | - | - | |
| 515-13-149-15-061002 | Mill-Max | SKT PGA SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 40-3503-21 | Aries Electronics, Inc. | CONN IC DIP SOCKET 40POS GOLD | 503 | -55°C ~ 125°C | Closed Frame | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Wire Wrap | - | - | |
| 123-93-642-41-001000 | Mill-Max | CONN IC DIP SOCKET 42POS GOLD | 123 | -55°C ~ 125°C | Open Frame | 3A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Wire Wrap | - | - | |
| 540-99-052-24-000000 | Mill-Max | CONN SOCKET PLCC 52POS TIN-LEAD | 540 | - | Closed Frame | - | Through Hole | Polyphenylene Sulfide (PPS) | Solder | - | - |
Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.