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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Mounting Type | Housing Material | Termination | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2229490-3 | Agastat Relays / TE Connectivity | CONN SOCKET PGA ZIF 947POS GOLD | - | - | Open Frame | - | Surface Mount | Thermoplastic | Solder | - | - | |
| 515-13-081-09-000003 | Mill-Max | SKT PGA SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 511-13-155-16-003002 | Mill-Max | SKT PGA SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 110-93-310-41-001000 | Mill-Max | CONN IC DIP SOCKET 10POS GOLD | 110 | -55°C ~ 125°C | Open Frame | 3A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Solder | - | - | |
| 515-13-081-12-071003 | Mill-Max | SKT PGA SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 123-83-312-41-001101 | Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 123 | -55°C ~ 125°C | Open Frame | 1A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Wire Wrap | - | - | |
| D01-9972442 | Harwin | CONN SOCKET SIP 24POS GOLD | D01-997 | -55°C ~ 125°C | - | 1A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | Solder | - | - | |
| 614-83-640-31-012101 | Preci-Dip | CONN IC DIP SOCKET 40POS GOLD | 614 | -55°C ~ 125°C | Carrier, Open Frame | 1A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Solder | - | - | |
| 514-87-127-16-091117 | Preci-Dip | CONN SOCKET PGA 127POS GOLD | 514 | -55°C ~ 125°C | Open Frame | 1A | Surface Mount | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Solder | - | - | |
| 2-641264-4 | Agastat Relays / TE Connectivity | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | -55°C ~ 125°C | Closed Frame | - | Through Hole | Thermoplastic, Glass Filled | Solder | - | - |
Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.