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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Mounting Type | Housing Material | Termination | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 522-13-052-09-045001 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - | |
| 614-93-125-13-041001 | Mill-Max | SKT CARRIER PGA | - | - | - | - | - | - | - | - | - | |
| 110-43-432-61-001000 | Mill-Max | CONN IC SKT DBL | - | - | - | - | - | - | - | - | - | |
| 38-1518-10T | Aries Electronics, Inc. | CONN IC DIP SOCKET 38POS GOLD | 518 | - | Open Frame | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Solder | - | - | |
| 614-83-325-18-111144 | Preci-Dip | CONN SOCKET PGA 325POS GOLD | 614 | -55°C ~ 125°C | Carrier, Open Frame | 1A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Solder | - | - | |
| 523-13-225-18-091001 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - | |
| 30-0518-00 | Aries Electronics, Inc. | CONN SOCKET SIP 30POS GOLD | 518 | - | Open Frame | 3A | Surface Mount | Polyamide (PA46), Nylon 4/6, Glass Filled | Solder | - | - | |
| 522-93-025-05-000003 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - | |
| ICA-632-SGT | Samtec, Inc. | CONN IC DIP SOCKET 32POS GOLD | ICA | -55°C ~ 125°C | Open Frame | 1A | Through Hole | Polyester, Glass Filled | Solder | - | - | |
| 522-13-168-17-101001 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - |
Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.