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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Mounting Type | Housing Material | Termination | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 110-13-624-41-001000 | Mill-Max | CONN IC DIP SOCKET 24POS GOLD | 110 | -55°C ~ 125°C | Open Frame | 3A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Solder | - | - | |
| 123-83-428-41-001101 | Preci-Dip | CONN IC DIP SOCKET 28POS GOLD | 123 | -55°C ~ 125°C | Open Frame | 1A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Wire Wrap | - | - | |
| 16-6503-31 | Aries Electronics, Inc. | CONN IC DIP SOCKET 16POS GOLD | 503 | -55°C ~ 125°C | Closed Frame | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Wire Wrap | - | - | |
| 32-6574-16 | Aries Electronics, Inc. | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | - | Closed Frame | 1A | Through Hole | Polyphenylene Sulfide (PPS), Glass Filled | Solder | - | - | |
| 123-43-328-41-801000 | Mill-Max | CONN IC SKT DBL | - | - | - | - | - | - | - | - | - | |
| D01-9972142 | Harwin | CONN SOCKET SIP 21POS GOLD | D01-997 | -55°C ~ 125°C | - | 1A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | Solder | - | - | |
| 116-93-628-41-007000 | Mill-Max | CONN IC DIP SOCKET 28POS GOLD | 116 | -55°C ~ 125°C | Elevated, Open Frame | 3A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Solder | - | - | |
| 515-93-145-13-041003 | Mill-Max | SKT PGA SOLDRTL | - | - | - | - | - | - | - | - | - | |
| 643644-3 | Agastat Relays / TE Connectivity | CONN SOCKET SIP 12POS TIN | Diplomate DL | -55°C ~ 105°C | Closed Frame | - | Through Hole | Thermoplastic, Glass Filled | Solder | - | - | |
| 612-91-420-41-001000 | Mill-Max | SKT CARRIER SOLDRTL | - | - | - | - | - | - | - | - | - |
Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.