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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Current Rating | Mounting Type | Housing Material | Termination | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 510-83-180-17-081101 | Preci-Dip | CONN SOCKET PGA 180POS GOLD | 510 | -55°C ~ 125°C | Open Frame | 1A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Solder | - | - | |
| AR20-HZW/T | ASSMANN WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | -40°C ~ 105°C | Open Frame | 3A | Through Hole | Thermoplastic, Polyester | Wire Wrap | - | - | |
| 115-93-306-61-003000 | Mill-Max | CONN IC SKT DBL | - | - | - | - | - | - | - | - | - | |
| 32-C212-20 | Aries Electronics, Inc. | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | -55°C ~ 105°C | Closed Frame | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Wire Wrap | - | - | |
| D84032B-46R | Harwin | CONN SOCKET PLCC 32POS TIN | D830 | -50°C ~ 105°C | Board Guide, Closed Frame | 1A | Surface Mount | Polyphenylene Sulfide (PPS) | Solder | - | - | |
| 123-93-422-41-801000 | Mill-Max | CONN IC DIP SOCKET 22POS GOLD | 123 | -55°C ~ 125°C | Open Frame, Decoupling Capacitor | 3A | Through Hole | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Wire Wrap | - | - | |
| 24-6518-00 | Aries Electronics, Inc. | CONN IC DIP SOCKET 24POS GOLD | 518 | - | Open Frame | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Solder | - | - | |
| 523-13-225-18-091002 | Mill-Max | SKT PGA WRAPOST | - | - | - | - | - | - | - | - | - | |
| 84-PGM13042-10T | Aries Electronics, Inc. | CONN SOCKET PGA TIN | PGM | -55°C ~ 105°C | - | 3A | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | Solder | - | - | |
| 614-41-306-31-012000 | Mill-Max | SKT CARRIER PGA | - | - | - | - | - | - | - | - | - |
Sockets for ICs and transistors are essential components in the electronics industry, providing a removable and replaceable interface for integrated circuits and transistors. These sockets facilitate easy installation and removal of semiconductor devices, allowing for convenient testing, maintenance, and replacement. Commonly used in development boards, prototyping, and production environments, these sockets ensure the efficient and reliable connection of ICs and transistors within electronic circuits.