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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 08-666000-00 | Aries Electronics, Inc. | SOCKET ADAPTER SOIC TO 8SOWIC | Correct-A-Chip® 666000 | - | - | - | - | - | Surface Mount | - | - | |
| 32-652000-11-RC | Aries Electronics, Inc. | SOCKET ADAPTER PLCC TO 32DIP 0.6 | Correct-A-Chip® 652000 | - | - | - | 1A | - | Through Hole | - | - | |
| 16-354000-21-RC | Aries Electronics, Inc. | SOCKET ADAPTER DIP TO 16SOIC | Correct-A-Chip® 354000 | - | - | - | 3A | - | Surface Mount | - | - | |
| PA-TS1D6SM18-56 | Logical Systems | ADAPTER 56TSOP TO 56DIP | - | - | - | - | - | - | Through Hole | - | - | |
| 32-450001-11-RC | Aries Electronics, Inc. | SOCKET ADAPTER SOJ TO 32DIP 0.4 | Correct-A-Chip® 450001 | - | - | - | - | - | Through Hole | - | - | |
| 1106396-20 | Aries Electronics, Inc. | SOCKET ADAPTER DIP TO 20DIP 0.6 | Correct-A-Chip® 1106396 | - | - | - | 3A | - | Through Hole | - | - | |
| 32-354000-10 | Aries Electronics, Inc. | SOCKET ADAPTER DIP TO 32SOIC | Correct-A-Chip® 354000 | - | - | - | 3A | - | Surface Mount | - | - | |
| 264-1300-29-0602J | 3M | RECEPTACLE DIP SOCKET 64POS .8" | Textool™ | -55°C ~ 125°C | - | Closed Frame | 1A | - | Through Hole | - | - | |
| 1107254-20 | Aries Electronics, Inc. | SOCKET ADAPTER DIP TO 20DIP 0.3 | Correct-A-Chip® 1107254 | - | - | - | 3A | - | Through Hole | - | - | |
| 218-3341-19-0602J | 3M | RECEPTACLE DIP SOCKET 18POS .3" | Textool™ | -55°C ~ 125°C | - | Closed Frame | 1A | - | Through Hole | - | - |
Adapters for sockets in ICs (integrated circuits) and transistors provide a bridge between different socket types or configurations. These adapters enable compatibility between various IC or transistor packages and socket layouts, allowing for easy integration into electronic circuits. Adapters enhance flexibility in circuit design, enabling engineers to accommodate different semiconductor packages without the need for significant redesign.