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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 240-3639-19-0602J | 3M | RECEPTACLE DIP SOCKET 40POS 1.0" | Textool™ | -55°C ~ 125°C | - | Closed Frame | 1A | - | Through Hole | - | - | |
| 24-35W000-10 | Aries Electronics, Inc. | SOCKET ADAPT SOIC-W TO 24DIP 0.3 | Correct-A-Chip® 35W000 | - | - | - | - | - | Through Hole | - | - | |
| 1109522 | Aries Electronics, Inc. | SOCKET ADAPTER DIP TO TO-8 | Correct-A-Chip® 1109522 | - | - | - | 3A | - | Through Hole | - | - | |
| 228-1277-39-0602J | 3M | RECEPTACLE DIP SOCKET 28POS .6" | Textool™ | -55°C ~ 125°C | - | - | 1A | - | Through Hole | - | - | |
| 14-651000-10 | Aries Electronics, Inc. | SOCKET ADAPTER SSOP TO 14DIP 0.6 | Correct-A-Chip® 651000 | - | - | - | 1A | - | Through Hole | - | - | |
| 24-651000-10 | Aries Electronics, Inc. | SOCKET ADAPTER SSOP TO 24DIP 0.6 | Correct-A-Chip® 651000 | - | - | - | 1A | - | Through Hole | - | - | |
| 68-652000-11-RC | Aries Electronics, Inc. | SOCKET ADAPTER PLCC TO 68DIP 0.6 | Correct-A-Chip® 652000 | - | - | - | 1A | - | Through Hole | - | - | |
| 12-350000-10-HT | Aries Electronics, Inc. | SOCKET ADAPTER SOIC TO 12DIP 0.3 | Correct-A-Chip® 350000 | - | - | - | - | - | Through Hole | - | - | |
| 44-505-110 | Aries Electronics, Inc. | SOCKET ADAPTER PLCC TO 44PGA | Correct-A-Chip® 505 | - | - | - | - | - | Through Hole | - | - | |
| 97-AQ132D | Aries Electronics, Inc. | SOCKET ADAPTER PQFP TO 132PGA | Correct-A-Chip® 97-AQ132D | - | - | - | - | - | Through Hole | - | - |
Adapters for sockets in ICs (integrated circuits) and transistors provide a bridge between different socket types or configurations. These adapters enable compatibility between various IC or transistor packages and socket layouts, allowing for easy integration into electronic circuits. Adapters enhance flexibility in circuit design, enabling engineers to accommodate different semiconductor packages without the need for significant redesign.