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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 222-3343-09-0602J | 3M | SOCKET ADAPTER 22DIP TO 22DIP | Textool™ | -55°C ~ 125°C | - | - | 1A | - | Through Hole | - | - | |
| 48-6645-18 | Aries Electronics, Inc. | SOCKET ADAPTER TQFP TO 48DIP 0.6 | Correct-A-Chip® 6645 | - | - | - | - | - | Through Hole | - | - | |
| 7131-108-18 | Aries Electronics, Inc. | SOCKET ADAPT HB2E RELAY TO 8DIP | - | - | - | - | - | - | Through Hole | - | - | |
| 1106396-32 | Aries Electronics, Inc. | SOCKET ADAPTER DIP TO 32DIP 0.6 | Correct-A-Chip® 1106396 | - | - | - | 3A | - | Through Hole | - | - | |
| 14-350000-10-HT | Aries Electronics, Inc. | SOCKET ADAPTER SOIC TO 14DIP 0.3 | Correct-A-Chip® 350000 | - | - | - | - | - | Through Hole | - | - | |
| 16-307349-11-RC-P (170 UP) | Aries Electronics, Inc. | SOCKET ADAPTER PLCC TO 16DIP 0.3 | Correct-A-Chip® 307349 | - | - | - | - | - | Through Hole | - | - | |
| 1106396-16 | Aries Electronics, Inc. | SOCKET ADAPTER DIP TO 16DIP 0.6 | Correct-A-Chip® 1106396 | - | - | - | 3A | - | Through Hole | - | - | |
| 240-3639-09-0602J | 3M | RECEPTACLE DIP SOCKET 40POS 1.0" | Textool™ | -55°C ~ 125°C | - | Closed Frame | 1A | - | Through Hole | - | - | |
| 44-653000-11-RC | Aries Electronics, Inc. | SOCKET ADAPTER PLCC TO 44DIP 0.6 | Correct-A-Chip® 653000 | - | - | Socket Included | 1A | - | Through Hole | - | - | |
| 28-653000-10 | Aries Electronics, Inc. | SOCKET ADAPTER PLCC TO 28DIP 0.6 | Correct-A-Chip® 653000 | - | - | Socket Included | 1A | - | Through Hole | - | - |
Adapters for sockets in ICs (integrated circuits) and transistors provide a bridge between different socket types or configurations. These adapters enable compatibility between various IC or transistor packages and socket layouts, allowing for easy integration into electronic circuits. Adapters enhance flexibility in circuit design, enabling engineers to accommodate different semiconductor packages without the need for significant redesign.