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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 242-1281-19-0602J | 3M | RECEPTACLE DIP SOCKET 42POS .6" | Textool™ | -55°C ~ 125°C | - | Closed Frame | 1A | - | Through Hole | - | - | |
| LCQT-QFP0.5-40-1 | Aries Electronics, Inc. | SOCKET ADAPTER MULT PKG TO 40QFP | Correct-A-Chip® | -55°C ~ 125°C | - | - | - | - | Through Hole | - | - | |
| 1109252 | Aries Electronics, Inc. | SOCKET ADAPTER PLCC TO 28DIP 0.6 | Correct-A-Chip® 1109252 | - | - | - | - | - | Through Hole | - | - | |
| 68-505-110-RC-P | Aries Electronics, Inc. | SOCKET ADAPTER PLCC TO 68PGA | Correct-A-Chip® 505 | - | - | - | - | - | Through Hole | - | - | |
| 264-4493-19-0602J | 3M | RECEPTACLE DIP SOCKET 64POS .9" | Textool™ | -55°C ~ 125°C | - | - | 1A | - | Through Hole | - | - | |
| 18-354000-21-RC | Aries Electronics, Inc. | SOCKET ADAPTER DIP TO 18SOIC | Correct-A-Chip® 354000 | - | - | - | 3A | - | Surface Mount | - | - | |
| 248-1282-39-0602J | 3M | RECEPTACLE DIP SOCKET 48POS .6" | Textool™ | -55°C ~ 125°C | - | Closed Frame | 1A | - | Through Hole | - | - | |
| 216-3340-09-0602J | 3M | SOCKET ADAPTER 16DIP TO 16DIP | Textool™ | -55°C ~ 125°C | - | Closed Frame | 1A | - | Through Hole | - | - | |
| 240-1280-39-0602J | 3M | RECEPTACLE DIP SOCKET 40POS .6" | Textool™ | -55°C ~ 125°C | - | Closed Frame | 1A | - | Through Hole | - | - | |
| 14-354000-20 | Aries Electronics, Inc. | SOCKET ADAPTER DIP TO 14SOIC | Correct-A-Chip® 354000 | - | - | - | 3A | - | Surface Mount | - | - |
Adapters for sockets in ICs (integrated circuits) and transistors provide a bridge between different socket types or configurations. These adapters enable compatibility between various IC or transistor packages and socket layouts, allowing for easy integration into electronic circuits. Adapters enhance flexibility in circuit design, enabling engineers to accommodate different semiconductor packages without the need for significant redesign.