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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Ingress Protection | Features | Current Rating | Packaging | Mounting Type | Type Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 16-350000-10-HT | Aries Electronics, Inc. | SOCKET ADAPTER SOIC TO 16DIP 0.3 | Correct-A-Chip® 350000 | - | - | - | - | - | Through Hole | - | - | |
| 08-350000-10-HT | Aries Electronics, Inc. | SOCKET ADAPTER SOIC TO 8DIP 0.3 | Correct-A-Chip® 350000 | - | - | - | - | - | Through Hole | - | - | |
| 240-1280-19-0602J | 3M | RECEPTACLE DIP SOCKET 40POS .6" | Textool™ | -55°C ~ 125°C | - | Closed Frame | 1A | - | Through Hole | - | - | |
| 68-304538-10 | Aries Electronics, Inc. | SOCKET ADAPTER PLCC TO 68PGA | Correct-A-Chip® 304538 | - | - | - | - | - | Through Hole | - | - | |
| 224-1275-29-0602J | 3M | RECEPTACLE DIP SOCKET 24POS .6" | Textool™ | -55°C ~ 125°C | - | Closed Frame | 1A | - | Through Hole | - | - | |
| 20-354000-11-RC | Aries Electronics, Inc. | SOCKET ADAPTER DIP TO 20SOIC | Correct-A-Chip® 354000 | - | - | - | 3A | - | Surface Mount | - | - | |
| 32-450001-10-P | Aries Electronics, Inc. | SOCKET ADAPTER SOJ TO 32DIP 0.4 | Correct-A-Chip® 450001 | - | - | - | - | - | Through Hole | - | - | |
| 228-1290-09-0602J | 3M | RECEPTACLE DIP SOCKET 28POS .4" | Textool™ | -55°C ~ 125°C | - | - | 1A | - | Through Hole | - | - | |
| 1107254-18 | Aries Electronics, Inc. | SOCKET ADAPTER DIP TO 18DIP 0.3 | Correct-A-Chip® 1107254 | - | - | - | 3A | - | Through Hole | - | - | |
| 28-450001-11-RC | Aries Electronics, Inc. | SOCKET ADAPTER SOJ TO 28DIP 0.4 | Correct-A-Chip® 450001 | - | - | - | - | - | Through Hole | - | - |
Adapters for sockets in ICs (integrated circuits) and transistors provide a bridge between different socket types or configurations. These adapters enable compatibility between various IC or transistor packages and socket layouts, allowing for easy integration into electronic circuits. Adapters enhance flexibility in circuit design, enabling engineers to accommodate different semiconductor packages without the need for significant redesign.