| Image | Part Number | Manufacturer | Description | Series | Features | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Contact Finish | Contact Finish Thickness | Number of Positions |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 150-80-642-01-899161 | Preci-Dip | DIL SURFACE MOUNT 2.54MM | 150 | - | Bulk | Surface Mount | - | - | Tin | - | 42 | |
| 373-10-135-00-001101 | Preci-Dip | HEADER TURRET WIRE WRAP 2.54MM | 373 | - | Bulk | Through Hole | - | - | Gold | 10.0µin (0.25µm) | 35 | |
| 380-10-104-00-001000 | Mill-Max | HEADER SNGL INLINE SOLDRTL 4POS | 380 | - | Bulk | Through Hole | - | - | Gold | 10.0µin (0.25µm) | 4 | |
| 334-40-161-00-020000 | Mill-Max | CONN HDR PIN | 334 | - | Bulk | Through Hole | RoHS Compliant | - | Tin | 200.0µin (5.08µm) | 61 | |
| 151-10-304-00-004000 | Mill-Max | HEADER OPEN .025"DIA .300 4POS | 151 | - | Tube | Through Hole | - | - | Gold | 10.0µin (0.25µm) | 4 | |
| 32-8625-31 | Aries Electronics, Inc. | 625 DIP HDR SCRW MACH CONTACT | 625 | - | Bulk | Through Hole | - | - | Gold | 10.0µin (0.25µm) | 32 | |
| 20-0600-21 | Aries Electronics, Inc. | 0600 STRIP-LINE HDR COINED CNTCT | 0600 | - | Bulk | Through Hole | - | - | Gold | 10.0µin (0.25µm) | 20 | |
| 151-80-650-00-005101 | Preci-Dip | DIL SOLDER TAIL 2.54MM | 151 | - | Bulk | Through Hole | - | - | Tin | - | 50 | |
| 163-10-318-00-001000 | Mill-Max | HEADER OPEN SLOT 3LVL.300 18POS | 163 | - | Tube | Through Hole | - | - | Gold | 10.0µin (0.25µm) | 18 | |
| 222-1-48-006 | CNC Tech | IC ADAPTER SOCKET .100 48POS SMD | - | - | Tube | Surface Mount | - | - | Gold | - | 48 |
Rectangular connectors with specialty pin headers cater to unique applications where specific pin configurations are required. These headers are designed to accommodate specialized needs, such as high-density connections, signal integrity, or customized pin layouts. Specialty pin headers contribute to the versatility of rectangular connectors, enabling engineers to tailor their designs to meet specific industry standards or application requirements.