Rectangular Connectors - Headers, Specialty Pin

Rectangular Connectors - Headers, Specialty Pin

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Manufacturer
Series
Features
Packaging
Mounting Type
RoHS Status
Manufacturer Part Number
Contact Finish
Contact Finish Thickness
Number of Positions

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Image Part Number Manufacturer Description Series Features Packaging Mounting Type RoHS Status Manufacturer Part Number Contact Finish Contact Finish Thickness Number of Positions
380-10-133-00-001000 Mill-Max HEADER SNGL INLINE SOLDRTL 33POS 380 - Bulk Through Hole - - Gold 10.0µin (0.25µm) 33
334-40-149-00-100000 Mill-Max CONN HDR PIN 334 - Bulk Through Hole RoHS Compliant - Tin 200.0µin (5.08µm) 49
48-6625-11 Aries Electronics, Inc. 625 DIP HDR SCRW MACH CONTACT 625 - Bulk Through Hole - - Gold 10.0µin (0.25µm) 48
64-9625-71 Aries Electronics, Inc. 625 DIP HDR SCRW MACH CONTACT 625 - Bulk Through Hole - - Gold 10.0µin (0.25µm) 64
334-90-122-00-010000 Mill-Max CONN HDR PIN 334 - Bulk Through Hole RoHS non-compliant - Tin-Lead 200.0µin (5.08µm) 22
342-10-123-00-594000 Mill-Max CONN HEADER 23POS .100 L.835 342 - Bulk Through Hole - - Gold 10.0µin (0.25µm) 23
380-10-158-00-001000 Mill-Max HEADER SNGL INLINE SOLDRTL 58POS 380 - Bulk Through Hole - - Gold 10.0µin (0.25µm) 58
173-10-428-00-001000 Mill-Max HEADER OPEN TURR 3LVL.400 28POS 173 - Tube Through Hole - - Gold 10.0µin (0.25µm) 28
134-10-624-00-010000 Mill-Max HEADER OPEN .030"DIA .600 24POS 134 - Tube Through Hole - - Gold 10.0µin (0.25µm) 24
370-80-160-00-001101 Preci-Dip HEADER TURRET SOLDER TAIL 2.54MM 370 - Bulk Through Hole - - Tin - 60

About Rectangular Connectors - Headers, Specialty Pin


Rectangular connectors with specialty pin headers cater to unique applications where specific pin configurations are required. These headers are designed to accommodate specialized needs, such as high-density connections, signal integrity, or customized pin layouts. Specialty pin headers contribute to the versatility of rectangular connectors, enabling engineers to tailor their designs to meet specific industry standards or application requirements.